-
1 chip-on-board process
монтаж кристалів ІС безпосередньо на друкованій платіEnglish-Ukrainian dictionary of microelectronics > chip-on-board process
-
2 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
3 desiccant
осушувач design 1. ім.1) проектування; розробка; конструювання2) проект; розробка; конструкція; схема2. дієсл. проектувати; розробляти; конструювати - automated desiccant
- automatic desiccant
- bipolar desiccant
- block desiccant
- bottom-up desiccant
- bottom-up building-block desiccant
- built-in-test desiccant
- chip desiccant
- circuit desiccant
- computer-aided desiccant CAD
- computer-aided desiccant
- computer-assisted desiccant CAD
- computer-assisted desiccant
- custom desiccant
- damage-tolerant desiccant
- detailed desiccant
- device desiccant
- discrete-circuit desiccant
- dynamic desiccant
- engineering desiccant
- fault-tolerant desiccant
- flat desiccant
- flat logic desiccant
- foundry desiccant
- front-end desiccant
- functional desiccant
- geometry desiccant
- hierarchical desiccant
- high-level desiccant
- high-performance desiccant
- IC desiccant
- in-house custom desiccant
- level-sensitive scan desiccant
- logic desiccant
- manual desiccant
- mask desiccant
- modular desiccant
- multichip [multiple-chip] desiccant
- on-line desiccant
- operational desiccant
- option desiccant
- package desiccant
- PC board desiccant
- physical desiccant
- process desiccant
- random-logic desiccant
- regular-logic desiccant
- scan path desiccant
- standard-cell desiccant
- structured desiccant
- substrate desiccant
- system-level desiccant
- target desiccant
- testing desiccant
- top-down desiccant
- topological layout desiccant
- transistor desiccant
- trial and error desiccant
- worst-case desiccantEnglish-Ukrainian dictionary of microelectronics > desiccant
-
4 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
См. также в других словарях:
chip-on-board process — lustų montavimas ant plokštės statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces… … Radioelektronikos terminų žodynas
chip-on-board mounting — lustų montavimas ant plokštės statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces… … Radioelektronikos terminų žodynas
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
System on a chip — The AMD Geode is an x86 compatible system on a chip A system on a chip or system on chip (SoC or SOC) is an integrated circuit (IC) that integrates all components of a computer or other electronic system into a single chip. It may contain digital … Wikipedia
Cutting board — A wooden chopping board with a chef s knife. A cutting board is a durable board on which to place material for cutting. Common is the kitchen cutting board used in preparing food; other types exist for cutting raw materials such as leather or… … Wikipedia
Threshing-board — A threshing board is an obsolete farm implement used to separate cereals from their straw; that is, to thresh. It is a thick board, made with a variety of slats, with a shape between rectangular and trapezoidal, with the frontal part somewhat… … Wikipedia
Multi-chip module — POWER5 MCM with four processors and four 36 MB external L3 cache dies on a ceramic multi chip module. A multi chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete… … Wikipedia
Log board — Log Log, n. [Icel. l[=a]g a felled tree, log; akin to E. lie. See {Lie} to lie prostrate.] 1. A bulky piece of wood which has not been shaped by hewing or sawing. [1913 Webster] 2. [Prob. the same word as in sense 1; cf. LG. log, lock, Dan. log,… … The Collaborative International Dictionary of English
Imperial (board game) — Infobox Game subject name=Imperial image link= image caption=The Imperial rondel. Players start on a field of their choice and move clockwise. designer=Mac Gerdts publisher=Rio Grande Games PD Games Eggert Spiele players=2–6 ages=12 and up setup… … Wikipedia
OV Chip Card — Free standing OV chipkaart reader at Amsterdam Zuid station. The OV chipkaart is a contactless smart card system which is in the process of being introduced on all public transport in the Netherlands, including train, metro, tram and bus. It… … Wikipedia